At Hot Chips 2026, Intel rolled out its liquid‑cooled Crescent Island accelerator, packing 480GB of HBM4 memory into a 350‑W design. The Xe3P architecture promises new benchmarks for inference‑centric AI.
Samsung's newest LPDDR5X-PIM combines memory and logic to slash AI inference latency by 3× while boosting bandwidth eightfold. This breakthrough could redefine how edge devices process machine learning workloads.
Intel’s next‑generation Diamond Rapids Xeon delivers a staggering 256 performance cores and a 1.28 GB last‑level cache, powered by an 18‑atom‑process chip that introduces AVX 10.2 and the new UCIe‑S interconnect. The architecture signals a new era for data‑center workloads and AI inference.
